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Microelectronics Manufacturing Engineer

Develop microelectronic packaging and methods and support transfer to manufacturing.
Develop microelectronics manufacturing assembly solutions involving flip-chip bonders, die attach, wire bonding, under-fill process, reflow ovens, laser marking, pick & place robots and packaging process solutions.
Create process, equipment and material specifications, write and maintain assembly build instructions.
Analyze assembly process requirements for new products and provide input to process development and production cost estimates.
Requirements:
Bachelor's Degree in Engineering, Physics, or similar.
3+ years of microelectronics packaging experience.
Hands-on equipment troubleshooting abilities.
Track record managing projects independently.
Industry leading salary, company paid benefits, matched 401(k), pension and retirement plan. Paid time off from start for personal and sick days; vacation packages and paid holidays off. Company stock participation, travel reimbursement, growth and advancement opportunities and fantastic work environment with a creative, innovative and highly-skilled team.
For complete details contact James A. Lockley, LT USN (Ret) at:
(609) 584-9000 ext 278
Or submit resume online at:
http://dmc9.com/jal/app.asp
Or email to:
1000018951_10007183(at)jobbank301.com
Please reference #3611104 when responding.
Education Requirements: Bachelor Degree
Minimum Experience Requirements: 2-5 years
Job City Location: South Brunswick
Job State Location: NJ
Job Country Location: USA
Salary Range: $90,000 to $130,000
WE ARE AN EQUAL OPPORTUNITY EMPLOYER and our employment decisions are made without regard to race, color, religion, age, sex, national origin, handicap, disability or marital status. We reasonably accommodate individuals with handicaps, disabilities and bona fide religious beliefs. Jobs Career Position Hiring. CONSIDERED EXPERIENCE INCLUDES: http://najobbank.com www.najobbank.com Top 10 Job Site Top 10 Careers Site Manufacturing Engineer Electronics Packaging Engineer Physicist Optics Laser Diode Flip-chip Bonders Die Bonders Wire Bonding Reflow Ovens SMT Surface Mount Through the Hole Laser Marking Pick & Place R Microelectronics Packaging
Disclaimer: We will make every effort to consider applications for all available positions and shall use one or more of the contact methods and addresses indicated in resume or online application. Indicated location may be proximate or may be desirable point of embarkation for paid or unpaid relocation to another venue. Job descriptions may fit single or multiple presently available or anticipated positions and are NOT an offer of employment or contract implied or otherwise. Described compensation is not definite nor precise and may be estimated and approximate and is negotiable depending on market conditions and candidate availability and other factors and is solely at the discretion of employers. Linguistics used herein may use First Person Singular and First Person Plural grammatical person construction for and with the meaning of Third Person Singular and Third Person Plural references. We reserves the right to amend and change responsibilities to meet business and organizational needs as necessary. Response to a specific posting or advertisement may result in consideration for other opportunities and not necessarily the incentive or basis of the response. Nothing herein is or may be considered a promise, guarantee, offer, pledge, agreement, contract, or oath.
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